TOP
공동기기
KUPID

논문

Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics

구분 : International Journal 저자 : 황석원 게재년월 : 2024.05 게재지 : Advanced Functional Materials

Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics